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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Power-Up
3. MRRs and Device Auto Initialization (DAI) Polling
After t INIT4 is satisfied (Te), only MRR commands and power-down entry/exit com-
mands are supported. After Te, CKE can go LOW in alignment with power-down entry
and exit specifications (see Power-Down (page 94)).
The MRR command can be used to poll the DAI bit, which indicates when device auto
initialization is complete; otherwise, the controller must wait a minimum of t INIT5, or
until the DAI bit is set, before proceeding.
Because the memory output buffers are not properly configured by Te, some AC param-
eters must use relaxed timing specifications before the system is appropriately config-
ured.
After the DAI bit (MR0, DAI) is set to zero by the memory device (DAI complete), the
device is in the idle state (Tf). DAI status can be determined by issuing the MRR com-
mand to MR0.
The device sets the DAI bit no later than t INIT5 after the RESET command. The control-
ler must wait at least t INIT5 or until the DAI bit is set before proceeding.
4. ZQ Calibration
After t INIT5 (Tf), the MRW initialization calibration (ZQ calibration) command can be
issued to the memory (MR10).
This command is used to calibrate output impedance over process, voltage, and tem-
perature. In systems where more than one Mobile LPDDR2 device exists on the same
bus, the controller must not overlap MRW ZQ calibration commands. The device is
ready for normal operation after t ZQINIT.
5. Normal Operation
After (Tg), MRW commands must be used to properly configure the memory (output
buffer drive strength, latencies, etc.). Specifically, MR1, MR2, and MR3 must be set to
configure the memory for the target frequency and memory configuration.
After the initialization sequence is complete, the device is ready for any valid command.
After Tg, the clock frequency can be changed using the procedure described in Input
Clock Frequency Changes and Clock Stop with CKE HIGH (page 103).
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
41
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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